Ucima promotes Italian packaging in Las Vegas
From 23 to 25 September, the Italian Automatic Packaging Machinery Manufacturers’ Association will be taking centre stage at Pack Expo, the most important event for the industry in North America.
Following its success in Chicago in 2018, Ucima is preparing to return to the USA for Pack Expo (23-25 September), one of the most important international exhibitions devoted to processing and packaging. This year’s venue is the Las Vegas Convention Center, the location that hosts the show in odd-numbered years. The seventh stop in the association’s 2019 international promotional programme, the show is an excellent networking opportunity and a unique showcase for Italian technology, which has always been highly appreciated and much in demand in the US market.
More than 50 Italian companies from the sector will take part in the event, including 11 as part of the delegation coordinated by the Italian Trade Agency ITA and Ucima. The Italian booth, located in the Upper South Hall of the Convention Center, will host the companies Apsol, C&C Group, Emmeti, GFT Automazioni, Ghezzi & Annoni, NO.EL., Pasta Technologies Group, Senzani Brevetti, SIAD Macchine Impianti, Tiberpack and Torq Packaging.
Visitors can stop by the Association’s institutional lounge to pick up the latest English issue of the magazine Packmedia Selection, with sections devoted to design, market data and technological innovation.
Pack Expo is one of the most important events in a key market for the Italian packaging industry. According to Ucima Research Department figures, the USA is one of the world’s largest packaging machinery importers with a total value of 3.1 billion euros in 2018 (up 11% on 2017). Italy is the second largest exporter after Germany with sales of 676.6 million euros (up 30.9% on 2017) and a 21.9% share of total imports.
Shortly before heading to Pack Expo, Ucima’s promotional tour has stopped off in Nigeria for the exhibition Propak West Africa and afterwards will continue towards E-Pack Tech (Shanghai, 23-26 October 2019).